As a Senior Software Engineer, you will architect and scale Sentry's billing infrastructure, ensuring accuracy and reliability while processing hundreds of billions of events daily.
Staff Package Design Engineer
📜 Description
- Collaborate with cross-functional teams to drive package designs that meet performance, reliability, and manufacturability requirements.
- Define package requirements from electrical, thermal, and mechanical perspectives in cooperation with design and layout teams.
- Utilize AutoCAD, GDS tools, and Cadence SiP Layout tool for physical design and manufacturing validation.
- Drive continuous improvement processes to ensure accuracy between the package interface and PCB.
- Work with teams to establish and maintain design rules for various packaging technologies.
- Develop test vehicles to assess bump placement and PCB proximity effects on chip performance.
🛠️ Requirements
- BS or above in Mechanical, Electrical, Chemical, or Materials Engineering
- Demonstrable experience in a packaging-related field
- Experienced Cadence SiP layout user
- Strong AutoCAD user
- Knowledge of packaging technologies, materials, package substrate design and assembly rules
- Understanding of electrical simulation results on a package design
- Familiarity or willingness to learn Cadence Virtuoso operation using Unix workstations
- Strong written and verbal communication skills; able to review technical ideas with customers and high-level management
- Self-starter with a strong sense of ownership and accountability for driving projects to completion
- Ability to build strong, influential relationships in a collaborative environment within a diverse setting
Full job description
Are you ready to make a significant impact in a fast-paced, innovative environment?
We are seeking a Staff Package Design Engineer to join our dynamic team in Edinburgh, UK. In this role, you’ll work closely with internal and external customers to develop cutting-edge packaging solutions for high-performance products including amplifiers, codecs, and DSPs. Our packaging technologies span from traditional wire-bond QFN to advanced WLCSP and flip-chip designs.
Main Responsibilities
Required Skills and Qualifications
- BS or above in Mechanical, Electrical, Chemical, or Materials Engineering
- Demonstrable experience in a packaging-related field
- Experienced Cadence SiP layout user
- Strong AutoCAD user
- Knowledge of packaging technologies, materials, package substrate design and assembly rules
- Understanding of electrical simulation results on a package design
- Familiarity or willingness to learn Cadence Virtuoso operation using Unix workstations
- Strong written and verbal communication skills; able to review technical ideas with customers and high-level management
- Self-starter with a strong sense of ownership and accountability for driving projects to completion
- Ability to build strong, influential relationships in a collaborative environment within a diverse setting
Preferred Skills and Qualifications
- Conversant with PCB and Die mechanical layout tools (e.g. Siemens Xpedition, Allegro PCB, Cadence Virtuoso)
- Broad reading in the area of interest and the desire to continue that reading with access to the high quality company library resource, material properties knowledge
- Must be broadly curious and knowledgeable, and willing to pursue mastery of new technical concepts through self-learning or training opportunities available through company resources
- Electrical simulation skills
- Experience using Siemens Fast 3D
- Experience using Siemens Calibre DRV
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