Staff Package Design Engineer

For over four decades, Cirrus Logic has been propelled by the top engineers in mixed-signal processing. Our rockstar team thrives on solving complex challenges with innovative end-user solutions for the world's top consumer brands. Cirrus Logic is also known for its award-winning culture, which was built on a foundation of inclusion and fairness, meaningful community engagement, and delivering enjoyable employee experiences at every turn. But we couldn’t do it without our extraordinary workforce – and that’s where you come in. Join our team and help us continue to make Cirrus Logic an exceptional place to grow your career! #LI-GG1  #LI-Hybrid HOTT Export control restrictions based upon applicable laws and regulations would prohibit candidates who are nationals of certain embargoed countries from working in this position without Cirrus Logic first obtaining an export license.  Candidates for this role must be able to access technical data without a requirement for an export license. We are unable to sponsor or obtain export licenses for this role. Cirrus Logic strives to select the best qualified applicant for any opening. Different approaches, ideas and points of view are both valued and respected. Employment decisions are made on the basis of job-related criteria without regard to race, color, religion, sex, national origin, age, protected veteran or disabled status, genetic information, or any other classification protected by applicable law.

Key Responsibilities

· Design package layouts, stack-ups, drawings, models, simulations, and design documentation to verify compliance with requirements and design standards

· Work tightly with Global Design (UK and US) I.C. and board teams to drive package designs that meet Cirrus performance, reliability, and manufacturability requirements

· Interface with cross functional teams (Design, Layout) to define package requirements from electrical, thermal, and mechanical point of view

· Utilize AutoCAD, GDS tools, Siemens Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation, and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information

· Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB

· Collaborate with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages

· Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues

· Grow and promote automation processes throughout the package design flow

· Close collaboration with customers to resolve various design issues between the piece part and PCB

Required Skills and Qualifications

· B.S. or higher degree in Mechanical or Electrical Engineering

· 5+ year's experience designing for manufacturability

· Experienced Cadence SiP layout user

· Strong AutoCAD user

· Knowledge of packaging technologies, materials, package substrate design, and assembly rules

· Understanding of electrical simulation results on a package design

Preferred Skills and Qualifications

· Conversant with PCB and Die mechanical layout tools (e.g. Siemens Xpedition, Allegro PCB, Cadence Virtuoso)

· Broad reading in the area of interest and the desire to continue that reading with access to the high-quality company library resources, material properties knowledge

· Must be broadly curious and knowledgeable, and willing to pursue mastery of new technical concepts through self-learning or training opportunities available through company resources

· Electrical simulation skills

· Experience using Siemens Fast 3D

· Experience using Siemens Calibre DRV